Product Usage:
Heat conduction copper powder is mainly used in the thermal module of the main structure of the main heat pipe, with the computer / LED / mobile phone / new energy automotive / medical and other industries continue to improve product performance, the corresponding heat pipe cooling capacity to be improved , And the capillary limit is the biggest difficulty in the performance of the heat pipe to overcome, just the shape of the copper powder corresponding to the porosity / capillary force to break through the capillary limit of the key material
Product Features:
Product purity is high
· Sintering shrinkage is stable
Porosity uniform control
· Low thermal resistance
· Capillary speed
Specification Table： Chemical properties： |
| Test Methods | lower limit | Upper limit |
Copper content，% | Chemical testing | 99.50 | |
Oxygen content，% | | | 4.0 |
Physical properties： |
Loose density，g/cm3 | MPIF 04 | 1.7 | 1.9 |
Liquidity，sec/50g | MPIF 03 | | 50 |
Particle size distribution，% | MPIF 05 | | |
+100 mesh | | | 6 |
-100~+150 mesh | | balance |
| -150~+200 mesh | | 50 | 70 |
-200 mesh | | | 10 |
Sintering performance: vibration frequency 25hz, time 90s, sintering conditions: 90min at 980 ℃ |
Sintering size change,% | MPIF44 | 9 | 13 |
Porosity，% | MPIF55 | 60 | |
