Product Usage:
Heat conduction copper powder is mainly used in the thermal module of the main structure of the main heat pipe, with the computer / LED / mobile phone / new energy automotive / medical and other industries continue to improve product performance, the corresponding heat pipe cooling capacity to be improved , And the capillary limit is the biggest difficulty in the performance of the heat pipe to overcome, just the shape of the copper powder corresponding to the porosity / capillary force to break through the capillary limit of the key material
Product Features:
Product purity is high
· Sintering shrinkage is stable
Porosity uniform control
· Low thermal resistance
· Capillary speed
Specification Table： Chemical properties： |
| Test Methods | lower limit | Upper limit |
Copper content,，% | Chemical testing | 99.50 | |
Oxygen content量，% | | | 0.4 |
| | | |
Physical properties： | | | |
Loose density，g/cm3 | MPIF 04 | 2.0 | 2.2 |
Liquidity，sec/50g | MPIF 03 | | 55 |
Particle size distribution，% | MPIF 05 | | |
+60 mesh | | | 3 |
-60/+100 mesh | | 60 |
| -100/+150 mesh | | balance | 5 |
-150 mesh | | | |
Sintering performance: vibration frequency 25hz, time 90s, sintering conditions: 980 ℃ 90min, N2 and H2 than 5: 1: |
Sintering size change，% | MPIF44 | 9 | 13 |
Porosity，% | MPIF55 | 60 | |
