Product Usage:
Spherical copper powder is mainly used in injection molding, 3d printing, cold spraying and other industries, electronic slurry, lubricants and other industries, which has a narrow particle size distribution, oxygen content, through a special surface treatment, the surface activity is further reduced, with Excellent mobility.
Product Features:
· Hypoxia content
Low impurity content, high purity
High growth embryo strength
· Excellent liquidity
Powder performance | Test Methods | lower limit | Upper limit |
Copper content，% | Chemical testing | 99.50 | |
Hydrogen loss，% | | | 0.25 |
other，% | | | 0.10 |
Lead content，% | | | 0.01 |
Cu（%） | Oxygen content（%） | Process performance |
≧99.6 | ≦0.1 |
Grade | form | Particle size distribution（μm） | Loose density(g/ml) | fluidity(S/50g) |
D50 | D10 | D97 |
DT-Cu1 | spherical | 1.0-2.5 | 0.4-0.8 | ＜3.5 | 2.3-3.0 | - |
DT-Cu2 | spherical | 2.5-4.0 | 1.0-1.6 | ＜7.5 | 2.8-3.2 | - |
DT-Cu3 | spherical | 4.0-6.0 | 2.0-3.0 | ＜9.0 | 3.6-4.4 | - |
DT-Cu4 | spherical | 6.0-8.0 | 3.0-3.5 | ＜15.0 | 3.6-4.7 | - |
DT-Cu5 | spherical | 8.0-10.0 | 3.5-4.8 | ＜20.0 | 3.6-4.7 | - |
DT-Cu400 | spherical | 10-20 | 5.0-10.0 | ＜30.0 | 4.8-5.5 | 28~45 |
DT-Cu300 | spherical | 20-30 | 7.0-15.0 | ＜45.0 | 4.8-5.5 | 24~30 |
DT-Cu200 | spherical | 30-40 | 10-20.0 | ＜90.0 | 4.8-5.5 | 22~28 |
