Product Grade: DT-Cu500
Product Usage:
DT-Cu500 for the conductive filler, friction materials, carbon products, diamond tools, thermal spraying materials, welding materials and other fields.
Product Features:
· Hypoxia content
Low impurity content, high purity
High growth embryo strength
· Excellent liquidity
Powder performance | Test Methods | lower limit | Upper limit |
Copper content，% | Chemical testing | 99.50 | |
Hydrogen loss，% | | | 0.25 |
other，% | | | 0.10 |
Lead content，% | | | 0.01 |
Loose density，g/cm3 | MPIF 04 | 2.70 | 2.90 |
Tap density，g/cm3 | | 3.70 | 4.0 |
Particle size distribution | Laser particle size | | |
D5 （μm） | | 2 | 5 |
D50（μm） | | 8 | 12 |
D95（μm） | | 14 | 18 |
